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THERMAL GREASE CL-O024-GROSGM-A TG-50

High Performance Contains diamond dust for increased heat transfer Thermal conductivity of 8.0 W / Mk. All-in-one application kit Easy to Apply Specially Sustainability and safety
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EMI *Terms and Conditions Apply
Vendor: UCC BD
BDT 1,000
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Thermaltake TG-50 Thermal Paste / Grease

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.

Thermaltake TG-50 Thermal Paste / Grease

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.

Products specifications
BrandThermaltake
ModelCL-O024-GROSGM-A
ColorBlack
Weight0.004000
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