THERMAL GREASE CL-O024-GROSGM-A TG-50
High Performance Contains diamond dust for increased heat transfer Thermal conductivity of 8.0 W / Mk. All-in-one application kit Easy to Apply Specially Sustainability and safety
EMI *Terms and Conditions Apply
Thermaltake TG-50 Thermal Paste / Grease
TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.